Author

• Hatam Abdul-Razzak Taha

Abstract

Element Cu have been deposited on ceramic substrate by use of physical vapor
deposition with plasma aided (Ion plating technology ) . The effect of deposition process parameter on
mechanical properties of copper thin films were studied ( adhesion and microhardness ) . Also effect of
surface nature and temperature annealing have been studied which obtained increase in adhesion and
microhardness with increase in applied voltage and annealing . SEM study show that the smooth surface
have good uniformity and interface type between the film and substrate .